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This procedure utilizes a particle counter applied to process panels typically used in semiconductor applications
APIMS is currently the method of choice for such dynamic tests because it is the commercially available technique capable of ppt moisture analysis with the fastest response time
but to specify the test method to be used when testing for parameters covered by this Test Method
200 mm notched polished single crystal silicon wafers
1-1104 (Reapproved 0723)
G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages StdTpc-Silicon Materials & Process Control This procedure utilizes a particleThis specification is a guideline for high volume production of leadframes for plastic leaded chip carrier semiconductor packages. It is a design guideline for packaging engineers, leadframe stampers, and mold manufacturers, and has been developed to meet the requirements of automatic assemblers. Referenced SEMI Standards SEMI G4 Specification for Integrated Circuit Leadframe Material SEMI G10 Standard Method of Mechanical Measurement for Leadframes